titanium sublimation pump filament

Product Description

Titanium Sublimation Pump (TSP) Assembly with Filament

This is a Titanium Sublimation Pump (TSP) assembly, a critical component for achieving and maintaining ultra-high vacuum (UHV) in research and industrial systems. It works by electrically heating an integrated titanium filament, causing titanium to vaporize and deposit on cooled surfaces, which then actively chemisorbs reactive gases like hydrogen, oxygen, and nitrogen.

Key Components & Function:

• Assembly: Includes the TSP body (typically a stainless steel flange with electrical feedthroughs) and the integrated titanium filament.

• Principle: Non-evaporable getter (NEG) pumping via periodic titanium sublimation.

• Purpose: Provides high pumping speed for reactive gases in UHV and extreme high vacuum (XHV) chambers, often used alongside ion pumps and turbomolecular pumps.

Applications:

• Maintaining UHV in surface science analysis chambers (XPS, AES, MBE)

• Particle accelerator and synchrotron beamlines

• Semiconductor processing research equipment

• Any UHV system requiring active getter pumping