Product Description
West-Bond 454630E-79 Wedge-Wedge Wire Bonder – Semi-Automatic Ultrasonic Bonder for Microelectronics Packaging
There are 2 in stock with minor variations. Pictures will show differences.
This used West-Bond 454630E-79 is a precision semi-automatic wire bonder designed for advanced microelectronics packaging applications . It is renowned for its precision, reliability, and efficiency in creating wire bonds in a wide range of semiconductor devices, making it essential for semiconductor manufacturers, research institutions, and electronic components suppliers . The model has been confirmed as a wedge-wedge bonder used in laboratories, including those at Carnegie Mellon University and the University of Waterloo .
The bonder operates on 115V/60Hz power (drawing 6A). The 45-degree wedge wire bonder is used for electrically connecting MEMS chips to standard packages using gold or aluminum wire . The machine performs bonding by using the wedge to mash the wire against the device surface while applying ultrasonic energy for a short time . Heat is also applied by a radiating coil around the wedge tool .
Condition Note: This unit is untested.
