Indium Corporation of America General Purpose Ribbon Research Solder Kit

The Indium Corporation of America General Purpose Ribbon Research Solder Kit is a premium laboratory-grade set designed for engineers, researchers, and technicians developing or testing solder materials. This kit contains a wide range of Indalloy solder ribbons, each formulated for specific melting points, wetting characteristics, and applications. Packaged in a durable foam-lined case, the kit is ideal for material evaluation, prototype assembly, and solderability testing.

Each ribbon is individually packaged and labeled with its Indalloy number for quick reference and consistent identification. The included Pocket Flux Selector Chart aids in pairing the correct flux for each alloy, streamlining your experimental and production workflow.

Included Indalloy Ribbons:

• Indalloy #121: 96.5Sn / 3.5Ag — Melting Point 221°C — Lead-free solder for high-reliability electronic assembly.

• Indalloy #165: 60Pb / 40Sn — Melting Point 183°C — General-purpose solder with good wetting and mechanical strength.

• Indalloy #184: 63Sn / 37Pb — Melting Point 183°C — Eutectic solder ideal for precision electronic joints.

• Indalloy #205: 90Pb / 10Sn — Melting Point 275°C — High-temperature solder for power and industrial applications.

• Indalloy #171: 50In / 50Pb — Melting Point 210°C — Excellent for hermetic sealing and joining dissimilar materials.

• Indalloy #197: 52In / 48Sn — Melting Point 118°C — Indium-tin alloy with low melting point for delicate assemblies.

• Indalloy #186: 95Pb / 5Sn — Melting Point 314°C — Used for die attach and thermal management applications.

• Indalloy #218: 80Au / 20Sn — Melting Point 280°C — High-strength, corrosion-resistant solder for aerospace and microelectronics.

Applications:

• Electronics and microelectronics research

• Materials science and metallurgical analysis

• Aerospace, defense, and semiconductor manufacturing

• Laboratory solder evaluation and reliability testing