10G DWDM Supermux with Virtex-4 FF1148 (FPGA), AMCC S19227PB11-2 Processor, Lattice Semiconductor Devices, and 10G Optical Transceivers
$3,500.00
1 in stock
Description
Description
Nortel SuperMux 10xSFP PCB
This package includes a high-performance Virtex-4 FPGA, advanced AMCC networking processor, and multiple Lattice semiconductor devices for extensive processing capabilities. The Supermux 10xSFP 10G DWDM significantly enhances data transmission efficiency by multiplexing multiple channels over a single fiber. Together, these components form a robust networking solution suitable for high-speed applications in telecommunications and data centers. The included capacitors, resistors, and thermal management components ensure reliable operation and optimal performance.
1. Virtex-4 FF1148 (FPGA)
• Description: The Virtex-4 FF1148 is a high-performance FPGA by Xilinx.
• Function: Designed for complex processing tasks, it can be reconfigured for various applications, including telecommunications, digital signal processing, and custom logic implementations.
2. AMCC S19227PB11-2 (Processor)
• Description: This is a networking processor from AMCC.
• Function: It handles packet processing, protocol handling, and other tasks in networking applications, making it suitable for high-speed data transmission environments.
3. Lattice Semiconductor Devices
• Description: Several Lattice semiconductor chips are present, indicating programmable logic functionality.
• Function: These FPGAs or CPLDs (Complex Programmable Logic Devices) allow for custom logic implementations and are typically used in telecommunications and data processing.
4. 10G SFP+ Modules
• Description: The system includes SFP+ ports for 10Gbps optical networking.
• Function: These ports accept SFP+ transceivers, enabling high-speed data transmission over fiber optics.
5. Supermux 10xSFP 10G DWDM
• Description: A Dense Wavelength Division Multiplexing (DWDM) device that supports up to 10 simultaneous 10G data streams.
• Function: It multiplexes multiple data signals onto a single fiber, optimizing bandwidth and increasing transmission capacity without the need for additional fiber.
6. Various Capacitors and Resistors
• Description: Passive components scattered across the board, such as capacitors and resistors.
• Function: These components are essential for filtering, energy storage, and voltage regulation in the circuit.
7. Heat Sinks and Thermal Management Components
• Description: Metal heat sinks attached to various chips.
• Function: They dissipate heat generated by high-performance components, ensuring stable operation and preventing overheating.
8. PCB Design Features
• Description: The printed circuit board (PCB) includes several routing layers and traces.
• Function: These design features enable interconnections between the components, supporting high-speed communication within the board.
Additional information
Additional information
| Weight | 5 lbs |
|---|---|
| Dimensions | 12 × 10 × 3 in |
