Metris XT V 160 Revolution X-Ray System

Description

Product Overview
The Metris XT V 160 Revolution X-Ray System is a high-end, non-destructive inspection system designed for advanced imaging and failure analysis of complex electronic components such as BGAs, PCBs, and multi-layer boards. This system utilizes cutting-edge X-ray and Computed Tomography (CT) technologies, providing detailed and precise 2D and 3D imaging. Ideal for use in industries requiring high-accuracy testing and quality control, including electronics, aerospace, and materials research, the Metris XT V 160 ensures thorough inspection capabilities for even the smallest and most intricate components.

Key Specifications

• Imaging Technology: X-Ray & Computed Tomography (CT)
• Maximum Magnification: 13,000x
• Rotation and Tilt: 360° rotation and 75° tilt for flexible and comprehensive inspection
• Inspection Mode: 2D and 3D imaging with automatic defect detection
• Resolution: High resolution for detailed imaging of fine structures such as solder joints and BGA balls
• Applications: Primarily for inspection of BGAs, µBGAs, multi-layer PCBs, and complex electronic assemblies
• System Dimensions: Compact footprint for easy integration into production lines and labs
• Power Supply: 100-240V, 50/60Hz
• Control Software: Advanced software for 3D visualization and detailed analysis

Key Features

• True Concentric Imaging: Maintains precise focus on the Region of Interest (ROI) while rotating or tilting the sample.
• 3D X-Ray and CT Imaging: Offers high-definition 3D reconstruction for thorough internal inspections of components, detecting voids, cracks, and solder defects.
• Flexible Inspection Angles: The system allows tilting up to 75°, providing comprehensive views from multiple angles.
• Automatic Defect Detection: The integrated software includes automatic defect detection, minimizing human error and speeding up analysis.
• Enhanced Magnification: Magnification capabilities of up to 13,000x, enabling detailed inspection of small components like BGAs, capacitors, and microchips.
• Compact Design: Despite its advanced capabilities, the XT V 160 features a compact design, making it suitable for use in limited spaces.
• Industry-Leading Imaging Quality: Exceptional clarity and contrast for the most challenging inspections, ensuring precision down to the finest details of an electronic assembly.

Applications

• Electronics Manufacturing: For inspecting solder joints, BGA, µBGA, and PCB assemblies.
• Aerospace: Analyzing components like connectors, microelectronic devices, and complex multi-layer boards.
• Materials Science: Conducting detailed analysis of materials and composites for research and quality control.
• Failure Analysis: Non-destructive testing to detect defects, cracks, and other internal issues that could affect the performance of electronic devices and systems.

Conclusion
The Metris XT V 160 Revolution X-Ray System is an essential tool for any lab or production environment requiring high-resolution X-ray and CT inspection. Whether used for failure analysis, quality control, or research, this system delivers unmatched imaging precision and flexibility. The system’s advanced features like 3D X-ray imaging and automatic defect detection make it an indispensable asset for industries that rely on the integrity and performance of their components.

Metris XT V 160 Revolution X-Ray System

X-Ray Inspection System

CT Capability Flat Panel Imager Eliminates Prallax Distortion

2400x Magnification

28″ x 30″ Ma board size (not CT)

0.5nm Resolution

We are not able to test the machine

Sold AS IS

No returns,

no warranties.

Customer’s responsibility to verify compatibility