-
A flux‑free, lead‑free solder alloy composed of Sn‑Ag‑Ti, developed by S‑Bond Technologies. It enables joining of metals, ceramics, composites, and dissimilar materials in ambient air without pre‑plating or flux.
-
Designed for a wide range of applications across electronics, thermal management, structural bonding, and more.
-
🔧 Key Properties
-
Joining Temperature: Typically 250–270 °C (480–580 °F).
-
Tensile Strength: Ranges between 4,100 and 7,000 psi (≈ 28–100 MPa), depending on the substrate pairing.
-
Density & Conductivity:
-
Density ~7.3 g/cm³.
-
Electrical resistivity ~1.6 μΩ·m; thermal conductivity ~48 W/m·K.
-
-
Corrosion Resistance: Titanium in the alloy provides passivation; good resistance to chloride environments
-
-
🏗️ Substrate Compatibility
-
Copper to Copper: Reliable bonds of ~20–40 MPa.
-
Aluminum to Steel: Strength up to ~45 MPa.
-
Stainless Steel, Ti, Al, SiC, glass, Kovar and more can be joined without pre‑cleaning or pre‑plating; joint strengths vary depending on the materials involved.
-
-
📘 Typical Applications
-
Heat sinks, cool plates, power electronics, and LED assemblies, including joining thermal pyrolytic graphite (TPG) to metals for high‑efficiency thermal management.
-
Dissimilar material bonding: ideal for joining metals to ceramics, composites, and even glass without brittle intermetallics or flux residue.
-
Utilized in aerospace, telecommunications, automotive, and general electronics industries.
-
| Weight | 1 lbs |
|---|---|
| Dimensions | 5 × 5 × 5 in |





