S-Bond Technologies SB-220 Soldering Alloy

A flux‑free, lead‑free solder alloy composed of Sn‑Ag‑Ti, developed by S‑Bond Technologies. It enables joining of metals, ceramics, composites, and dissimilar materials in ambient air without pre‑plating or flux.

Designed for a wide range of applications across electronics, thermal management, structural bonding, and more. 

🔧 Key Properties

• Joining Temperature: Typically 250–270 °C (480–580 °F).

• Tensile Strength: Ranges between 4,100 and 7,000 psi (≈ 28–100 MPa), depending on the substrate pairing.

• Density & Conductivity:

  • Density ~7.3 g/cm³.

  • Electrical resistivity ~1.6 μΩ·m; thermal conductivity ~48 W/m·K.

• Corrosion Resistance: Titanium in the alloy provides passivation; good resistance to chloride environments

🏗️ Substrate Compatibility

• Copper to Copper: Reliable bonds of ~20–40 MPa.

• Aluminum to Steel: Strength up to ~45 MPa.

• Stainless Steel, Ti, Al, SiC, glass, Kovar and more can be joined without pre‑cleaning or pre‑plating; joint strengths vary depending on the materials involved.

📘 Typical Applications

• Heat sinks, cool plates, power electronics, and LED assemblies, including joining thermal pyrolytic graphite (TPG) to metals for high‑efficiency thermal management.

• Dissimilar material bonding: ideal for joining metals to ceramics, composites, and even glass without brittle intermetallics or flux residue.

• Utilized in aerospace, telecommunications, automotive, and general electronics industries.