Hybond 572 Thermosonic Wedge Bonder

Description

Product Overview
The Hybond 572 Thermosonic Wedge Wire and Ribbon Bonder is a high-precision bonding system designed for advanced microelectronics, semiconductor, and research applications. This versatile bonder supports both wire and ribbon bonding using thermosonic wedge bonding technology, ensuring strong, reliable interconnects for delicate components. With user-friendly operation and precise control over bonding parameters, the Hybond 572 is ideal for engineers and researchers working in semiconductor packaging, hybrid circuits, and RF/microwave applications.

Key Specifications

• Bonding Method: Thermosonic wedge bonding
• Wire Compatibility: Gold and aluminum wire (typically 17–75 µm diameter)
• Ribbon Compatibility: Gold and aluminum ribbon (up to 250 µm wide)
• Ultrasonic Frequency: 60 kHz for precise bonding control
• Bonding Force: Adjustable for optimized bonding strength
• Applications: Semiconductor packaging, hybrid microcircuits, RF/Microwave components

Key Features

• Versatile Wire and Ribbon Bonding: Supports both gold and aluminum wire/ribbon for various applications.
• Precision Control: Adjustable bonding parameters ensure high accuracy and repeatability.
• Thermosonic Technology: Combines heat, ultrasonic energy, and pressure for strong, reliable bonds.
• User-Friendly Interface: Simplifies setup and operation, making it ideal for research and production environments.
• Broad Application Range: Suitable for aerospace, RF/microwave, semiconductor, and research labs.

Conclusion
The Hybond 572 Thermosonic Wedge Wire and Ribbon Bonder delivers exceptional precision and reliability for microelectronics and semiconductor applications. Its versatility, ease of use, and advanced bonding capabilities make it an essential tool for researchers and engineers seeking high-performance interconnect solutions.